JPH0440276Y2 - - Google Patents
Info
- Publication number
- JPH0440276Y2 JPH0440276Y2 JP1841386U JP1841386U JPH0440276Y2 JP H0440276 Y2 JPH0440276 Y2 JP H0440276Y2 JP 1841386 U JP1841386 U JP 1841386U JP 1841386 U JP1841386 U JP 1841386U JP H0440276 Y2 JPH0440276 Y2 JP H0440276Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lower mold
- chamber
- resin
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1841386U JPH0440276Y2 (en]) | 1986-02-12 | 1986-02-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1841386U JPH0440276Y2 (en]) | 1986-02-12 | 1986-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62131434U JPS62131434U (en]) | 1987-08-19 |
JPH0440276Y2 true JPH0440276Y2 (en]) | 1992-09-21 |
Family
ID=30812067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1841386U Expired JPH0440276Y2 (en]) | 1986-02-12 | 1986-02-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440276Y2 (en]) |
-
1986
- 1986-02-12 JP JP1841386U patent/JPH0440276Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62131434U (en]) | 1987-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR940007754Y1 (ko) | 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조 | |
JPS6233317Y2 (en]) | ||
JPH0440276Y2 (en]) | ||
CN216544413U (zh) | 一种嵌件包胶悬空进料模具 | |
JPH0319818A (ja) | 成形方法 | |
US5044419A (en) | Hollow post cylindrical sprue casting method | |
JP2666630B2 (ja) | 半導体装置の製造方法 | |
JPH0290633A (ja) | 半導体装置用樹脂封止金型 | |
JP2518661B2 (ja) | 半導体素子の樹脂封止成形方法及び装置 | |
JP2502387B2 (ja) | 半導体素子の樹脂封止方法及び樹脂封止金型 | |
JPS635227Y2 (en]) | ||
JPH1050746A (ja) | 電子部品の樹脂封止成形方法及びその成形方法に用い られる樹脂材料 | |
JP2675503B2 (ja) | 射出成形用樹脂型及び型装置 | |
JP2694293B2 (ja) | 高圧縮成形樹脂タブレットの成形方法 | |
JPH05166866A (ja) | 電子部品の樹脂封止成形方法と装置及びリードフレーム | |
JPS649713A (en) | Resin molding die | |
JPS63228631A (ja) | 半導体素子を樹脂封止する金型装置 | |
JPS5967639A (ja) | 半導体樹脂封止用金型 | |
JPS6366051B2 (en]) | ||
JPH0351111A (ja) | 樹脂封止装置 | |
JP2587539B2 (ja) | 半導体装置の樹脂封止用金型 | |
JP2536418B2 (ja) | 半導体素子の樹脂封止用金型 | |
JPS6119105B2 (en]) | ||
JPS629720Y2 (en]) | ||
JPS6240850B2 (en]) |